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Xiaomi Redmi 10A listed on TENAA with key specs

Xiaomi Redmi 10A listed on TENAA with key specs
Image: Gsmarena

Last month, we saw Geekbench and FCC listings for the upcoming Xiaomi Redmi Note 10A appear. The device has now been certified on the TENAA database bearing the same 220233L2C model number revealing its key specs.

Redmi 10A will bring a 6.53-inch IPS LCD with HD+ resolution 1600×720px and a 5MP selfie cam. The rear houses a 13MP main cam. Redmi 10A will use a Helio G25 chipset and the listing confirms the phone will come in no less than four trims with 2/32GB, 3/32GB, 3/64GB and 4/128GB options. The battery is listed at 4,900 mAh while the software front will be handled by MIUI 12.5 on top of Android 11. TENAA also reveals the phone will feature an SD card slot, fingerprint scanner while the listed dimensions are 164.9×77×9.0mm.

From Gsmarena

Here are the specifications of Samsung’s four upcoming mid-range phones

Image: Sammobile

Now that Samsung is done launching its non-foldable high-end phones for the year, it is preparing to launch mid-range devices. The company will soon launch at least four mid-range smartphones, including the Galaxy A23, Galaxy A33, Galaxy A53, and Galaxy A73. Specifications of these four devices have been leaked.

According to tipster @Shadow_Leak, the Galaxy A23 5G will sport a 6.6-inch IPS LCD display with Full HD+ resolution and a 90Hz refresh rate. It could come equipped with the MediaTek Dimensity 700 processor. At the rear, it is expected to feature a 50MP primary camera, an 8MP ultrawide camera, and two 2MP cameras. The phone reportedly runs Android 11 out of the box, but that’s hard to believe. The Galaxy A23 5G could be powered by a 5,000mAh battery, featuring support for 15W charging.

The Galaxy A33 5G will reportedly feature a 6.4-inch Super AMOLED display with Full HD+ resolution. Apparently, there’s no high-refresh-rate display on this phone. It could come equipped with the MediaTek Dimensity 720 processor. It could have a 48MP primary camera, an 8MP ultrawide camera, a 5MP macro camera, and a 2MP depth sensor. Like the Galaxy A23 5G, the Galaxy A33 5G could be powered by a 5,000mAh battery and support 15W fast charging.

The Galaxy A53 5G has a 6.52-inch Super AMOLED Infinity-O display with a 120Hz refresh rate and Full HD+ resolution. It is expected to use the yet-unannounced Exynos 1200 processor. The phone could run Android 12 out of the box. At the rear, it has a 64MP main camera, a 12MP ultrawide camera, and two 5MP cameras. A previous leak had revealed that it is powered by a 5,000mAh battery, bigger than the Galaxy A52s 5 G’s 4,500mAh cell.

The Galaxy A73, which will be Samsung’s priciest mid-range device, will reportedly feature a 6.7-inch Super AMOLED display with Full HD+ resolution and a 120Hz refresh rate. It could use the Snapdragon 750G processor. It could get a camera upgrade with a 108MP primary camera. Other cameras include a 12MP ultrawide camera, an 8MP telephoto camera, and a 2MP depth sensor. It is powered by a 5,000mAh battery and supports 25W fast charging.

From Sammobile

Realme GT Neo3 tipped to come in two battery sizes, charge at up to 150W

Realme RMX3560 and RMX3562 on TENAA
Image: Tenna

About a couple of weeks ago, reliable tipster Digital Chat Station claimed that Realme would launch smartphones with 80W and 150W charging speeds, which they now say will be two versions of the Realme GT Neo3. One will pack a 4,500 mAh battery with 150W charging and the other a 5,000 mAh cell with 80W charging.

These could be the RMX3560 and RMX3562 smartphones spotted on TENAA recently. The former was listed with a battery having a rated capacity of 2,440 mAh, and the latter with a 2,180 mAh cell. But these are likely the sizes of a single cell, and the total typical battery capacities should be 4,500 mAh and 5,000 mAh, respectively.

The rest of the specs revealed by TENAA include a 6.7″ FullHD+ AMOLED screen, 2.85GHz octa-core processor, an in-display fingerprint scanner, and four cameras – a 16MP selfie shooter on the front, with the camera system on the rear comprising 50MP, 8MP, and 2MP units. Both models have two RAM (8GB/12GB) and three storage (128GB/256GB/512GB) options.

There’s no word from Realme about the GT Neo3 yet, but the company recently announced it will introduce the “world’s fastest smartphone charging technology” on February 28, 2022 at Mobile World Congress (MWC).

Realme hasn’t divulged how fast this charging technology will be, but a leaked image of an unreleased Realme charger suggests it could go up to 200W.

From Gsmarena

Amazon’s 2nd Gen Echo Buds are finally available in India

Echo Buds 2nd Gen case and ear tips
Image: Amazon

Amazon’s Alexa-powered Echo speakers have become a cultural phenomenon. But not many people know that the company also sells Bluetooth earphones dubbed the Echo Buds. In April last year, Amazon refreshed its earphones lineup with the Echo Buds 2nd Gen, featuring an updated design and ANC support. Initially exclusive to the western markets, the new buds have finally launched in India.

The Echo Buds 2nd Gen will be available on Amazon India at ₹11,999 for the USB Type-C model. Meanwhile, the wireless charging model will set you back ₹13,999. Amazon is offering a flat ₹1,000 off both models for a limited time.

From XDA

Google Pixel 7 and 7 Pro renders give us our first unofficial look at the range

Image: OnLeaks / Smartprix

We’re not expecting to get an official look at the Google Pixel 7 or the Pixel 7 Pro until around October, but we’re already getting an unofficial look at both phones.

Reputable leaker Steve Hemmerstoffer, known on Twitter as OnLeaks, has shared high-definition renders of the Pixel 7 via Carhp, and of the Pixel 7 Pro via Smartprix.

These renders suggest that the Google Pixel 7 range might not look much different to the Google Pixel 6 range, though there are some tweaks.

First off, the dual-tone look that we saw in the Pixel 6 range is still present. The horizontal camera island that runs through the width of the device will seemingly also be retained, but Google seems to have given it the Samsung Galaxy S21 Ultra treatment by merging it with the phone’s frame, giving it a cleaner look.

From Techradar

OPPO launches the new Find X5, Find X5 Pro flagships, and Enco X2 TWS globally

OPPO launches the new Find X5, Find X5 Pro flagships, and Enco X2 TWS globally
Image: Oppo

Every major Android OEM has a product series that features its top-of-the-line specifications across all relevant areas. These product lineups are an amalgamation of the best chip, the best display, the best design, the best battery tech, and the best cameras that the OEM has for the mainstream consumer. OPPO’s Find X series is its flagship lineup, and ahead of MWC, the company has lifted the wraps off the OPPO Find X5 and the OPPO Find X5 Pro, succeeding the Find X3 series as the company’s top smartphone. The company is also launching the OPPO Enco X2 earphones, succeeding the widely acclaimed Enco X as the top-tier TWS.

From XDA

Leaked Intel Roadmap Reveals More Efficient Chip Than M1 Pro and Max to Launch Within Two Years

Image: Adored TV

The roadmap by Intel, initially leaked by AdoredTV and interpreted by Wccftech, explicitly states that Intel wants to compete with Apple’s 14-inch MacBook Pro with its Arrow Lake series. According to the roadmap, Intel’s 15th generation Arrow Lake processors could be ready to ship by late 2023, or early 2024 with a priority on delivering high-performance while using minimal energy.

With Arrow Lake, it looks like Intel is prioritizing mobile over desktop first and while there will be both Arrow Lake-S and Arrow Lake-P CPUs, the company is aiming to specifically produce its 15th Gen mobility CPUs first to tackle Apple’s next-generation MacBook 14″ laptops. Based on the leaked roadmap, it looks like we will see the first engineering samples ready by late 2022 and early 2023 with QS chips shipping out in Q3 2023 and final production beginning the same quarter. And lastly, the CPUs will be ready for RTS (Ready To Ship) in Q4 2023. So this means we are looking at a late 2023 or early 2024 launch for the next-generation Arrow Lake mobility CPU lineup.

The roadmap also says that Intel will utilize TSMC’s 3nm process. Apple currently utilizes the 5nm process for its latest chips and is expected to adopt the 3nm chip architecture in 2023 with the “M3” Apple silicon chip and A17 chip in the iPhone 15.

Intel has already beaten Apple’s ‌M1 Max‌ chip on paper if you ignore high-energy consumption and poor battery life. Benchmarks show that Intel’s latest Core i9 processors received a higher score than Apple’s ‌M1 Max‌ chip in tests, but that 4% increase in performance is offset by a marked reduction in battery life compared to Apple’s chips. Tests show that a laptop with Intel’s latest i9 Core chip only lasts six hours for video playback. In comparison, Apple advertises the latest 16-inch MacBook Pro as getting up to 21 hours of battery life for offline video playback.

From Macrumors

Intel’s Evo spec leaves out gaming laptops and PCs

Intel Evo badge
Image: Intel

Intel representatives said Wednesday that the company currently doesn’t have any plans to release an Evo specification for gaming, even as Evo PCs containing Intel’s H-series gaming processors roll out this year. Still, the Evo specification itself will help define what features laptops shipping with Intel’s new 12th-gen Core chips inside will include.

Intel formally released its new 12th-gen Core “Alder Lake” U-series and P-series processors on Wednesday, after originally announcing the chips in January. This was in conjunction with Alder Lake-H, the high-end notebook processor for the gaming market. It appears that Intel views content creation as the same target audience as gaming based on the response to an emailed question about an Evo badge for gaming PCs.

“We don’t have plans for a gaming specific Evo brand at this time,” an Intel representative said in an emailed statement. “At CES, we did announce that you will see laptops with H-series processors pass Evo verification this year. Our research showed us that content creators have many of the same needs as the highly mobile, Intel Evo-buyer. They want larger screens, higher performance on the go AND responsiveness, battery life, instant wake and fast charge. “

From The PC world

AMD teases performance of its revolutionary 3D V-cache chip

AMD 3D V-Cache architecture.
Image: AMD

AMD is currently readying its new Ryzen 7 5800X3D, featuring a 3D V-cache, and it looks like we may soon have a powerful processor on our hands. AMD has teased that we can expect an up to 15% performance boost over the base Ryzen 7 5800X.

The tech giant talked about the new chip during the International Solid-State Circuits Conference (ISSSC) and revealed more information about its architecture. While the Ryzen 7 5800X3D will certainly be an improvement, will it be enough to compete with Intel’s best processors?

Before AMD moves on to Zen 4 later this year, it plans to release the Zen 3-based Ryzen 7 5800X3D. First confirmed during CES 2022, the processor is said to feature an innovative architecture, and this is exactly what AMD covered during its ISSSC segment. As far as the consumer market goes, this CPU will be the first processor to feature an additional stacked cache.

The new Ryzen 7 5800X3D comes as a successor to the Ryzen 7 5800X, and although AMD has made some substantial changes, the basic Zen 3 chip was already prepared to accommodate the improvements brought on by the new model. As noted by PC Gamer, AMD has designed the cache on Zen 3 in a way that allows future upgrades, in this case, cache stacking.

Every Zen 3 chiplet comes with 32MB of L3 cache split among eight on-die cores, but that number can be increased up to 96MB when you add 64MB of stacked static RAM (SRAM). AMD explained that the stacked chip is attached via copper bonding and retains a small size, measuring just 41mm². This technology is what AMD has used to create its 3D V-Cache used in the consumer CPUs, first found in AMD’s workstation EPYC processors.

AMD’s 3D V-Cache is made out of multiple 8MB parts, each with 1,024 contact points between the V-Cache and each core complex (CCX), adding up to a total of 8,192 contact points when eight 8MB segments are used. This architecture allows for some massive bandwidth, perhaps exceeding two terabytes per second for each 8MB “slice.” Using this architecture results in slightly larger chiplets, so AMD has also had to make adjustments in order to make the processor retain the size of other Ryzen 5000 CPUs.

Ryzen 7 CPUs are also available in higher variants, but it’s pretty unlikely (if not impossible) that AMD will be releasing 3D V-Cache versions of the 5900X or the 5950X. As these more advanced Ryzen chips come with more than eight cores, they’d also require extra power and cooling compared to the Ryzen 7 5800X3D, perhaps to the point where it’s no longer plausible or viable to pursue. AMD has also said that eight-core CPUs are the ideal middle ground for gaming, so it’s likely going to stick to the Ryzen 7 5800X3D.

Until some actual benchmarks of the new AMD CPU emerge, it will be difficult to estimate how it will match up against Intel’s latest and greatest, the Core i9-12900K. However, if the 15% boost in performance proves to be true, it’s very likely that AMD’s latest offering will be able to compete with the high-end Core i9-12900K in terms of gaming. As we get closer to its launch, some benchmarks will undoubtedly begin to leak soon.

From Digital Trends

Astronomers discovered what’s inside a black hole for the first time ever

Supermassive black hole at spiral galaxy center
Image: BGR

Black holes could be a hologram. In fact, the entire universe could be a hologram. At least, that’s one part of the idea behind a recent study published in the journal PRX Quantum. The study is a deeper look at what’s inside a black hole. It’s also an attempt to better understand the idea of holographic duality. Holographic duality is a mathematical conjecture that attempts to connect theories of particles and their interactions and the theory of gravity. It’s an interesting idea, even if it sounds a little out there.

From BGR

I’m a tech savvy person who occasionally cook and party. I am an engineer by profession and tech enthusiast by passion.
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